A chemical etchant (and a method for forming the etchant) is disclosed for removing thin films of titanium-tungsten alloy microelectronic chip fabrication. The tungsten heavy alloy microelectronic removed is preferably 10% Ti and 90% W, which is layered onto a substrate under chromium and copper seed layers for electrode position of C4 solder bumps. Tungsten heavy alloy microelectronic products are widely used in computers and other machines.
In the application of tungsten heavy alloy microelectronic the Ti--W etchant should not attack aluminum, chromium, copper, or lead-tin solders, and should dissolve Ti--W rapidly. The invention achieves this with a mixture of 30% by weight hydrogen peroxide and water, to which is added EDTA and potassium sulfate.Tungsten heavy alloy microelectronic products vary in size and shape.
Microelectronic products generate radiation that can be harmful to people's body. Tungsten alloy microelectronic has high radiation absorption, this property determines as the first choice of material to make microelectronic products. That is one of the reasons why the tungsten microelectronic products are very popular. Tungsten heavy alloy microelectronic is non-toxic and environmentally friendly, it can be reused and recycled. The society advocate sustainable development, tungsten alloy is the perfect material to produce tungsten heavy alloy microelectronic products. The property of high temperature resistance is another reason for manufacturers to choose tungsten alloy as the material to produce tungsten heavy alloy microelectronic products. When the tungsten heavy alloy microelectronic products are used, they produce a lot of heat; many of the products made by other materials cannot withstand these extreme conditions. We can provide all kinds of tungsten microelectronic products according to your requirements.