Tungsten copper ultra thin sheet high performance composites are fabricated from carefully controlled porous tungsten that is infiltrated with molten copper. This results in a WCu composite that has high conductivity and a matched low thermal expansion for heat sinks.
Our tungsten copper ultra thin sheet composite is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion characteristics of tungsten, tungsten copper has properties similar to those of silicone carbide, aluminum oxide, and beryllium oxide. The thermal conductivity and low expansion also make tungsten copper alloy an excellent choice even for extremely dense circuits.
The CuW75 tungsten copper is used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-power electronic devices. As a tungsten copper material, it is a composite, so both the thermal advantages of copper and the very low expansion characteristics of tungsten can be utilized.
The combination of tungsten & copper materials results in thermal expansion characteristics similar to those of silicone carbide, aluminum oxide, and beryllium oxide, used as chips and substrates. Because of tungsten copper's thermal conductivity and expansion characteristics, Tungsten copper alloy works well in densely packed circuits.
Advantages of tungsten copper ultra thin sheet:
Good electrical conductivity
Low thermal diffusion
Applications of tungsten copperultra thin sheet:
LED lighting tungsten copper heat sink
Laser field of tungsten copper heat sink
Tungsten copper alloy conductive switch of the electronic field
2.Tungsten Copper Sheet
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